1.0Glosarixhttps://glosarix.com/en/Team Glosarixhttps://glosarix.com/en/author/adm_glosarix/rich600338<blockquote class="wp-embedded-content" data-secret="nMhOpgSaL7"><a href="https://glosarix.com/en/glossary/qfp-en/">QFP</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://glosarix.com/en/glossary/qfp-en/embed/#?secret=nMhOpgSaL7" width="600" height="338" title="“QFP” — Glosarix" data-secret="nMhOpgSaL7" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://glosarix.com/wp-includes/js/wp-embed.min.js </script> Description: The QFP (Quad Flat Package) is a type of surface mount packaging for integrated circuits, designed to facilitate the integration of electronic components in various applications. This package is characterized by its square or rectangular shape and the arrangement of pins that allow electrical connection with the printed circuit board (PCB). Its compact and […]